8 ZONES 1400MM PCB REFLOW OVEN FOR SMT SOLDERING PROCESS

For electronic manufacturers, SMT reflow oven is a necessary equipment for PCB lines. Use SMD reflow oven for the thermal processing of soldering surface-mount electronic components to circuit boards. The RF-B830T PCB oven have 8 heating zones, which you can individually control for temperature. These zones are for heating a printed circuit board to thermal set points, and they are followed by cooling sections. Every prototype PCB has its own set temperature standards the product needs to hit in each zone while making its way through the reflow oven machine.

• PID Digital Temperature Control System
• High temperature Lead Free Soldering applications up to 400°C
• Horizontal Convection heating technology
• Stainless steel conveyor
• 1400mm Long Heat Tunnel
• Upper 4 Heating Zones + Bottom 4 Heating Zones
• 300mm wide conveyor
• Easy lift clamshell design
• Heat resistance fan
• High-Efficiency and Energy-Saving Heating Tube

Model: RF-B830T

Heating Zone: Upper 4 Heating Zones + Bottom 4 Heating Zones

Heating Method: Hot air

Cooling Zone: 2 Natural Air Cooling

Heat Tunnel length: 1400mm

Mesh Width: 300mm

PCB Width Allowance: Max. 280mm

PCB Height Allowance: ≤20mm (Customize Acceptable)

Mesh Height: 880±20mm

Conveyor Speed: 0-1350mm/min

Conveyor Direction: Left→Right (Right→Left)

Preheat Time: 15-20mins

Soldering Time: 3.5-5.5mins

Temperature Range: 0°C-400°C

Temperature Control: PID Digital Temperature Control System

Voltage: AC 380V, 50Hz

Starting Power: 11KW

Working Power: 3.5KW

Net Weight: 255kgs

Gross Weight: 355kgs

Machine Size: L2440×W680×H1200mm

Package Dimension: 2600*816*1350mm

RF-B830T Reflow Oven Brochure